Fibocom H330S


UMTS/HSPA+(WCDMA/FDD)  850/900/1900/2100MHz *1
GSM 850/900/1800/1900MHz *1
    

UMTS/HSDPA/HSUPA/HSPA+ 3GPP Release 7
HSPA+ max uplink 5.76Mbps(Cat 6)
HSPA+ max downlink 21Mbps(Cat 14)
HSDPA max downlink 7.2Mbps(Cat 8) (Optional)
GSM 3GPP Release 7
EDGE(E-GPRS) multi-slot class 33
GPRS multi-slot class 33

Obudowa LGA
Wymiary:33.8 x 27.8 x 2.45mm
Waga: 5g
Temperatura pracy: -30~ +85 ºC
Temperatura przechowywania: -40~ +85 ºC


*1=H330 Axx-xx only support WCDMA 900/2100MHz and GSM900/1800MHz

Fibocom H350

    
Najmniejszy moduł 3G

 

UMTS/HSPA+(WCDMA/FDD)  900/2100MHz
GSM 900/1800MHz

 

UMTS/HSDPA/HSUPA/HSPA+ 3GPP Release 7
HSPA+ max uplink 5.76Mbps(Cat 6)
HSPA+ max downlink 21Mbps(Cat 14)
HSDPA max downlink 7.2Mbps(Cat 8) (Optional)
GSM 3GPP Release 7
EDGE(E-GPRS) multi-slot class 33
GPRS multi-slot class 33

Obudowa LGA
Wymiary :29.8mm x 17.8mm x 2.00 mm
Waga:2.5g
Temperatura pracy: -30~ +85 °C
Temperatura przechowywania: -40~  +85 °C